Pre‑order Features: 19‑inch 4:3 full‑bonded display, IP65 front‑panel dust‑proof & splash‑proof, fanless passive cooling design, embedded & wall‑mount dual installation, abundant industrial I/O ports, industrial anti‑interference performance, stable 7×24h workshop central‑control operation
[Introduction] YPC‑MX‑190 is a 19‑inch 4:3 full‑bonded fanless industrial touch all‑in‑one PC designed for workshop central‑control applications. The full‑bonded screen eliminates air gap between touch layer and LCD, lowering surface reflection, improving touch sensitivity and anti‑fog capability for clear viewing under complex factory environment.
Its front‑panel meets IP65 protection grade, effectively blocking workshop dust, oil mist and liquid splashes. Adopting fully‑enclosed fanless structure without rotating fan parts, it avoids dust clogging and fan failure, greatly reducing later maintenance workload. It supports both embedded cabinet installation and wall‑mount installation, adapting to diversified layout requirements of central‑control room and field operation stations.
Integrated hardware watchdog and auto‑power‑on recovery function guarantee unattended continuous operation. It can complete workshop centralized data display, equipment status monitoring and production parameter setting, compatible with MES, SCADA and other industrial software for secondary development.
[System] Optional Intel 7th/10th/12th‑Gen Core i3/i5/i7 processors. RAM and SSD can be configured flexibly to meet multi‑software concurrent running and local data storage demand. Compatible with Windows and Linux industrial operating systems for seamless connection with mainstream factory automation platforms.
[Heat Dissipation] Adopts fanless passive heat conduction solution. CPU heat is evenly transferred to alloy housing for natural heat dissipation. Zero mechanical rotating parts achieve low‑noise, maintenance‑free long‑time running in factory workshops.
[Environment Adaptation] Industrial‑grade EMC anti‑interference design resists electromagnetic disturbance from inverters and field mechanical equipment. Wide‑temperature design adapts to temperature fluctuation of factory site. Reinforced housing structure copes with workshop vibration and impact.
[Interfaces] Dual Gigabit Ethernet ports and multiple switchable RS232/RS485 COM ports ensure stable connection with PLC, sensors and data acquisition devices. Multiple USB, HDMI and audio interfaces provide sufficient peripheral expansion space. Reserved slots support WIFI, Bluetooth and 4G module expansion to satisfy various networking modes.
| Item | 7th Gen Config | 10th Gen Config | 12th Gen Config |
|---|---|---|---|
| Model | YPC‑MX‑190 | YPC‑MX‑190 | YPC‑MX‑190 |
| Display | 19" TFT‑LCD,4:3,1280*1024 | 19" TFT‑LCD,4:3,1280*1024 | 19" TFT‑LCD,4:3,1280*1024 |
| Touch | Full‑bonded Capacitive Touch | Full‑bonded Capacitive Touch | Full‑bonded Capacitive Touch |
| Brightness | 300cd/m² | 300cd/m² | 300cd/m² |
| Processor | Intel 7th Gen i3/i5/i7 | Intel 10th Gen i3/i5/i7 | Intel 12th Gen i3/i5/i7 |
| Network | 1*Gigabit LAN(optional dual‑LAN) | 2*Gigabit LAN | 2*Gigabit LAN |
| Memory | 1*SO‑DIMM,Max 32GB | 2*SO‑DIMM,Max 64GB | 2*SO‑DIMM,Max 64GB |
| I/O | 2COM(RS232/485 switchable),2USB3.0,USB2.0,HDMI,Audio | 2COM(RS232/485 switchable),2USB3.0,Dual LAN,HDMI | 2COM(RS232/485 switchable),2USB3.0,Dual LAN,HDMI |
| Expansion | Mini‑PCIE(4G),M.2 2230(WIFI/BT) | Mini‑PCIE(4G),M.2 2230(WIFI/BT) | Mini‑PCIE(4G),M.2 2230(WIFI/BT) |
| Storage | 2.5"SATA HDD/SSD | M.2 2280 NVMe/SATA+2.5"SATA | M.2 2280 NVMe/SATA+2.5"SATA |
| Power | DC12V(opt.9‑36V wide voltage) | DC12V(opt.9‑36V wide voltage) | DC12V(opt.9‑36V wide voltage) |
| OS | Windows7/10/11,Linux | Windows10/11,Linux | Windows10/11,Linux |
| Mounting | Embedded / Wall Mount | Embedded / Wall Mount | Embedded / Wall Mount |
| Protection | IP65 Front Panel | IP65 Front Panel | IP65 Front Panel |
| Cooling | Fanless Passive Cooling | Fanless Passive Cooling | Fanless Passive Cooling |
| Working Env | ‑10℃~60℃,10%‑90% non‑condensing | ‑10℃~60℃,10%‑90% non‑condensing | ‑10℃~60℃,10%‑90% non‑condensing |
| Chassis | Alloy Housing | Alloy Housing | Alloy Housing |
| No. | Model | Version | CPU | Memory | LAN | COM | Power |
|---|---|---|---|---|---|---|---|
| 1 | YPC‑MX‑190 | 7th‑A | 7th i3/i5/i7 | 1*SO‑DIMM | 1 | 2 | 12V(opt9‑36V) |
| 2 | YPC‑MX‑190 | 7th‑B | 7th i3/i5/i7 | 1*SO‑DIMM | 2 | 6 | 12V(opt9‑36V) |
| 3 | YPC‑MX‑190 | 10th‑B | 10th i3/i5/i7 | 2*SO‑DIMM | 2 | 6 | 12V(opt9‑36V) |
| 4 | YPC‑MX‑190 | 12th‑B | 12th i3/i5/i7 | 2*SO‑DIMM | 2 | 6 | 12V(opt9‑36V) |